Co-Packaged Optics Packaging Process Development Engineer
Core
Drive assembly process technology development for 2.5D/3D Co-Packaged Optics (CoW) and AI products from concept to high volume manufacturing, ensuring design for manufacturing, reliability, and cost.
Role type
Senior IC process development engineer (semiconductor packaging)
Builds
2.5D/3D CoW assembly solutions, high density interconnects with TSVs, and advanced package solutions for AI and data infrastructure.
Domain
Semiconductor manufacturing, advanced packaging, photonics integration
Required skills
wafer process development, 2.5D/3D CoW assembly, chemistry development with consumable suppliers, physics of failures analysis, NPI management, project management, cross-functional team leadership, executive-level communication, problem-solving, analytical ability
Preferred skills
photonics packaging experience, component & system level reliability testing
Technologies
TSV, 2.5D/3D packaging, OSAT processes, foundry process nodes
Responsibilities
Manage qualification of packages with sensitivity to physics of failures for high thermo-mechanical reliability; Drive ideation and innovation of advanced package solutions and specifications with vendors; Identify and mitigate risk to new technologies used in product integration; Ensure factory readiness through maturing product during the NPI phase; Work with cross-functional packaging teams and lead process development at foundry along with 2.5D/3D CoW process development.
Seniority
Senior, hands-on IC