System Hardware (SIPI) Engineer, Principle
Core
Lead RF designs, analysis, and optimization of high-speed interconnects and power distribution networks across advanced PCBs, de-embedded structures, and packages for silicon characterization of high-speed SerDes SoC products.
Role type
Principal Signal & Power Integrity Engineer
Builds
High-speed SerDes SoC products, PCBs, and system-level interconnects for data infrastructure
Domain
Semiconductor, high-speed analog/mixed-signal, optical interconnects, datacenter/cloud infrastructure
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
electromagnetic theory, transmission lines, RF concepts, analog design principles, high-speed SerDes architecture, IEEE 802.3 standards, OIF standards, SI/PI simulation tools (HFSS, SIwave, ADS, HSPICE, Q3D), PCB layout modification, Vector Network Analyzer (VNA) operation, probe station calibration, technical leadership, cross-functional collaboration
Preferred skills
path-finding research in electromagnetic modeling, PDN optimization, advanced packaging, silicon debug, system robustness testing
Technologies
HFSS, SIwave, ADS, HSPICE, Q3D, VNA, probe station
Responsibilities
Define and lead SI/PI activities and analysis for PCBs and system-level interconnects; Develop and refine methodologies for modeling, simulation, and measurement correlation; Drive innovation in I/O and channel architectures; Collaborate across teams to define test fixtures for silicon characterization and debug; Mentor and coach engineers; Perform path-finding research in electromagnetic modeling and PDN optimization; Support customers with SI/PI expertise
Seniority
Principal, technical leadership & mentorship
