Sr. Principal Engineer, Manufacturing Infrastructure
Core
Developing automated test architectures and technology roadmaps to transition next-generation silicon into high-volume production, focusing on power, thermal, and mechanical challenges of high-density chips and advanced optical technologies.
Role type
Sr. Principal Engineer, Manufacturing Infrastructure
Builds
Automated test architectures and technology roadmaps for high-volume manufacturing (HVM) of advanced silicon and optical products.
Domain
Semiconductor manufacturing infrastructure, advanced packaging, silicon photonics, and high-speed interconnects.
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Systems integration for high-speed custom silicon, mechanical design, product engineering, technology transfer from R&D to HVM, project management for complex hardware cycles, cross-functional leadership, industry trend analysis in photonics and packaging.
Preferred skills
Experience with Known Good Die (KGD), Co-Packaged Optics (CPO), and Co-Packaged Copper (CPC) solutions.
Technologies
None explicitly listed beyond domain-specific hardware concepts.
Responsibilities
Orchestrate end-to-end integration and delivery of complex infrastructure programs, drive technical milestones for new test hardware development, act as a central integration point between Thermal, Mechanical, Photonic, and Signal Integrity teams, capture and translate customer roadmaps into internal engineering schedules, strengthen partner relationships for manufacturing readiness, drive transfer-to-manufacturing protocols, own comprehensive project schedules and risk mitigation, represent advancements at industry conferences, monitor industry trends in advanced packaging and photonics, optimize solutions for manufacturing yield and throughput.
Seniority
Principal, strategy & mentorship
