Advanced Packaging SI/PI Senior Staff Engineer
Core
Senior IC engineer responsible for signal and power integrity (SI/PI) verification and design optimization in advanced 2D/2.5D/3D semiconductor packaging.
Role type
Senior IC signal and power integrity engineer (advanced packaging)
Builds
High-speed interface systems (HBM, DDR, SERDES, Die2Die) and custom package designs for data infrastructure
Domain
Semiconductor industry, advanced packaging, high-speed digital design
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Signal integrity concepts, Power integrity concepts, Circuit extraction, Simulation and analysis tools (Ansys HFSS, Keysight ADS, Cadence Sigrity), High-speed interface design (HBM, DDR, SERDES, Die2Die), Semiconductor packaging technologies, Substrate and PCB design
Preferred skills
Technical leadership, Cross-functional collaboration, Design methodology and strategies
Technologies
Ansys HFSS, Keysight ADS, Cadence Sigrity
Responsibilities
Evaluate package or PCB designs for challenging electrical requirements, Execute simulation tasks for signal and power integrity sign-off, Perform wiring studies for optimal signal routing and power delivery verification, Interface with physical designers and IP teams to optimize electrical performance, Document analysis results and present findings to internal teams, Participate in cross-functional meetings and design reviews
Seniority
Senior, hands-on IC
