Advanced Packaging Designer - Power Modules
Core
Lead the design, development, and optimization of advanced power module packaging solutions, ensuring high-performance, reliable, and manufacturable power electronic products.
Role type
Senior IC packaging engineer (power modules)
Builds
Power module packages for industrial, automotive, and renewable energy applications
Domain
Power electronics / Semiconductor packaging
Required skills
Advanced Package Design (APD), 3D CAD modeling, thermal management, electrical isolation design, mechanical robustness, DFM/DFA, simulation interpretation, material selection, interconnect technologies
Preferred skills
SolidWorks, Creo, experience with DBC/AMB/leadframe technologies, mentorship
Technologies
Cadence APD, SolidWorks, Creo
Responsibilities
Develop and optimize power module package architectures from concept to production; Create detailed APD layouts, package structures, and interconnect designs; Lead package design reviews and ensure compliance with specifications; Collaborate with cross-functional teams on design trade-offs; Mentor junior designers in power design concepts.
Seniority
Senior, hands-on IC
