ENGR STAFF, PACKAGE DEVELOPMENT
Core
Lead new package development from conceptualization to functional prototypes, conducting POC builds, benchmarking technologies, and managing technical risks for semiconductor packaging solutions.
Role type
Staff IC package development engineer
Builds
Fully functional packaging prototypes and POC demonstrations
Domain
Semiconductor manufacturing / Packaging technology
Required skills
Semiconductor package development, POC build execution, technology benchmarking, project timing estimation, IP management, technical risk assessment, cross-functional collaboration, program management, materials analysis, design review
Preferred skills
None stated
Technologies
None stated
Responsibilities
Conduct tests and research on basic materials and properties involved in packaging, develop solutions, provide recommendations on technical approach or design, manage technical risks to ensure deployment of mitigation actions, conduct design reviews and risk assessments with other technical experts, interact with Manufacturing, Reliability and Business Units to close engineering gaps and ensure smooth production transfer
Seniority
Staff, hands-on IC