Senior Engineer, APTD Operations
Core
Manage technology development and engineering builds for semiconductor manufacturing, specifically Advanced Packaging Technology Development (APTD) and High Bandwidth Memory (HBM), ensuring timely execution and resource readiness.
Role type
Senior Operations Management Engineer (Semiconductor Manufacturing)
Builds
Semiconductor memory and storage products (DRAM, NAND, NOR) and advanced packaging solutions.
Domain
Semiconductor Manufacturing / Advanced Packaging
Required skills
Project/Program Management, Operations Management, Process Engineering, Cross-functional stakeholder management, Risk management, Data analysis, Logistics coordination, Technical documentation management
Preferred skills
HBM experience, Advanced packaging flows knowledge, AI tool integration
Technologies
SAP, Teamcenter, Manufacturing Execution Systems (MES), SharePoint, Confluence, Power BI, Power Apps, Excel
Responsibilities
Define and execute build plans, milestones, and schedules; Forecast build, material, cost, and resource requirements; Optimize build schedules and logistics; Supervise daily execution including wafer offloading and kitting; Coordinate engineering builds and APTD operations; Lead cross-functional improvement initiatives; Monitor and communicate operation status to stakeholders; Integrate AI-assisted tools to improve efficiency.
Seniority
Senior, hands-on IC