Package / Process Development Engineer
Core
Lead R&D initiatives for die preparation processes including laser groove/ablation, mechanical dicing, and stealth dicing to develop and optimize semiconductor packaging solutions.
Role type
Senior IC process development engineer (semiconductor packaging)
Builds
New die preparation process technologies and refined packaging workflows
Domain
Semiconductor manufacturing / Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Wafer singulation process expertise, Semiconductor packaging technologies and materials knowledge, Process development methodology, Experimental design and data analysis, Process documentation and control planning, Technical leadership and mentoring
Preferred skills
Project management experience
Technologies
Laser groove, Ablation, Mechanical dicing, Stealth dicing
Responsibilities
Design and conduct experiments to develop and refine packaging processes, Analyze experimental data to identify trends and optimize process parameters, Develop comprehensive process documentation and control plans, Address and resolve complex process-related challenges, Mentor and provide technical leadership to junior engineers, Ensure R&D activities comply with industry standards and company policies
Seniority
Senior, hands-on IC with technical leadership