Process Engineer
Core
Provide engineering support for backend semiconductor packaging processes, including flip chip bonding, reflow soldering, and plasma cleaning to achieve output, quality, and yield targets.
Role type
Process Engineer (semiconductor backend manufacturing)
Builds
Semiconductor interconnect packages and electronic systems
Domain
Semiconductor manufacturing / Hardware Engineering
Required skills
Data analysis, problem-solving, critical thinking, statistical tools (SPC, MSA), process troubleshooting, documentation management, cross-functional collaboration
Preferred skills
Knowledge of semiconductor assembly, experience with SPC and MSA, proficiency in Microsoft Office
Technologies
Flip chip bonding, reflow soldering, plasma cleaning, SPC, MSA
Responsibilities
Monitor and analyze process data to identify trends and risks; Lead troubleshooting for process abnormalities and yield loss; Drive corrective and preventive actions for quality issues; Evaluate new products and processes during pilot runs; Maintain work instructions, control plans, and FMEA documents; Apply statistical and quality tools to enhance process stability and productivity.
Seniority
Mid-level (2+ years preferred) or Entry-level (fresh graduates with strong aptitude)
