Assembly Process Engineer
Core
Design, monitor, optimize, and improve semiconductor manufacturing processes (Wafer Saw, Die Attach, Wirebond) to ensure safety, efficiency, and cost-effectiveness.
Role type
Process Engineer (Semiconductor Manufacturing)
Builds
Semiconductor fabrication processes and equipment
Domain
Semiconductor manufacturing / Electronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Statistical Process Control (SPC), root-cause analysis, Design of Experiments (DOE), cleanroom protocols, data analysis, process optimization
Preferred skills
Cross-functional collaboration, project management, documentation
Technologies
Wafer Saw, Die Attach, Wirebond equipment
Responsibilities
Design and improve fabrication processes; analyze production data to find root causes of defects; plan and run experiments to test new materials or methods; collaborate with equipment, quality, and design teams; write and update standard operating procedures and process specifications
Seniority
Individual Contributor