Process Integration Engineer (PI)
Core
Lead SiC process integration in technology development, transfer, and qualification to enable new wide bandgap technologies and products meeting customer requirements and manufacturability.
Role type
Process Integration Engineer (SiC technology ramp)
Builds
New SiC technologies and products for manufacturing factories
Domain
Semiconductor manufacturing / Wide bandgap (SiC) technology
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor device physics, microelectronics, failure analysis, process integration flow, experiment design and analysis, big data analysis for root-cause identification, test structure and methodology development, project schedule management, cross-functional team leadership
Preferred skills
Advanced degree in semiconductor processing or device physics
Technologies
SiC, fab tools, module unit processes
Responsibilities
Lead SiC process integration in technology development/transfer and qualifications; Design/execute/analyze experiments to improve performance and yield; Manage process design/route, engineering run plan and controls; Analyze big data to identify weaknesses in process flow or root-cause of issues; Create new test structures and test methodologies; Set design rules and process control limits based on technology/product performance margins
Seniority
Mid-level, hands-on IC