New Product Introduction Engineer
Core
End of Line process development and enabling technology for transfer molded power modules.
Role type
New Product Introduction Engineer (Power Module Package)
Builds
Transfer molded power modules (Intelligent Power Module, Dual Side Cooling Module, Power Discrete)
Domain
Power electronics manufacturing / Semiconductor packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
DFMEA/PFMEA analysis, KPIV/KPOV definition, process capability analysis, statistical analysis (JMP, Minitab), tooling and jig design, equipment setup, technical reporting, process roadmap creation, design rule generation, customer requirement interpretation, defect root cause analysis
Preferred skills
DSC experience, experience with gel filled packages, experience with specific power module types (Intelligent Power Module, Dual Side Cooling Module, Power Discrete)
Technologies
JMP, Minitab, Auto-CAD
Responsibilities
Develop and improve End of Line processes for transfer molded power modules; Generate and update DFMEA and PFMEA linked to design failures; Define KPIV and KPOV based on failure modes and process capability; Create Control Plans and process deliverables; Initiate new processes and equipment with suppliers; Generate P.O specs and COO for new processes; Benchmark new processes and equipment; Create technology roadmaps for molding; Design tooling and jigs; Lead technicians and operators; Support quality issues during production
Seniority
Mid-Senior, hands-on IC