Integration Engineer
Core
Driving technology transfer and manufacturability for next-generation discrete power FET technologies and CMOS from concept through high-volume manufacturing.
Role type
Staff Manufacturing Integration Engineer (semiconductor)
Builds
Discrete power FET devices (trench MOSFETs, superjunction, CMOS) and system-level solutions
Domain
Semiconductor manufacturing / Power electronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Device architecture definition, electrical performance monitoring, process window optimization, device characterization, failure analysis, root-cause analysis (DOE, 6-sigma, SPC, FMEA), technology ramp management, 300mm fabrication knowledge, project leadership
Preferred skills
Matrix management, executive-level presentation, cross-functional collaboration
Technologies
Back-Grind, Back Metallization, Packaging, Dicing, Singulation, ILT, WAT, PCM, Probe, 300mm fab
Responsibilities
Monitor electrical performance and device performance to optimize Rds(on), switching performance, ruggedness, and power density; Partner with process module owners to optimize process windows and resolve integration challenges; Perform device characterization, electrical testing, and failure analysis; Drive structured root-cause analysis for yield, reliability, or device-related issues; Collaborate with systems engineering, product engineering, packaging, and applications teams to integrate power FETs into system-level solutions; Provide technical guidance, coaching, and mentorship to junior engineers; Present technical content in executive-level reviews
Seniority
Staff, hands-on IC with matrix management