Wire Bond Engineer (Ultrasonic)
Core
Own, characterize, and sustain ultrasonic wire bonding processes to deliver robust interconnect quality, high yields, and reliable semiconductor packages.
Role type
Process Engineer (Ultrasonic Wire Bonding)
Builds
Semiconductor packages with Al and Al-based wire interconnects
Domain
Semiconductor manufacturing / Physical/clinical work
Deliverable
physical/clinical work
Required skills
Ultrasonic bonding fundamentals, IMC formation analysis, DOE, SPC, PFMEA, root cause analysis, tooling life definition, statistical problem solving
Preferred skills
Thermosonic wire bonding experience, Al wire interconnects experience
Technologies
Orthodyne, K&S Power Fusion, Shinkawa platforms
Responsibilities
Optimize ultrasonic wire bonding processes and parameters, troubleshoot wire bond defects using 8D and DMAIC, lead process characterization through DOE and window validation, manage bonding tools and consumables, support customer audits and compliance activities
Seniority
Mid-level, hands-on IC