GaN/BCD/Power Device Process Integration Engineer
Core
Develop and optimize GaN/BCD power device processes and technologies for external foundries to ensure manufacturability and production yield.
Role type
Process Integration Engineer (GaN/BCD)
Builds
GaN/BCD power devices and processes
Domain
Semiconductor manufacturing, Power electronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
GaN/BCD device physics, process flow integration, yield analysis, device characterization, failure analysis, statistical process control (SPC), design of experiments (DOE), new product introduction (NPI) management, foundry collaboration
Preferred skills
Module experience, new technology joint development in external foundries
Technologies
SPC, DOE, test chip, tapeout, IP merges, masks
Responsibilities
Collaborate with R&D and foundry to develop/optimize GaN/BCD power devices and processes; Perform advanced device characterization; Conduct detailed yield analysis to identify failure modes; Implement statistical process control (SPC) and design of experiments (DOE) methodologies; Manage multiple projects ensuring timely delivery; Coordinate with cross-functional teams to align project goals and deliverables
Seniority
Mid-to-Senior, hands-on IC