Senior Packaging Development Engineer - Substrate Modules
Core
Optimizing high-speed process parameters for component attach, stack-up, and molding technologies to enable competitiveness in high-volume semiconductor manufacturing.
Role type
Senior IC packaging development engineer (substrate modules)
Builds
Power modules and substrate packages for semiconductor applications
Domain
Semiconductor manufacturing / Power electronics
Required skills
Process optimization, material down-selection, yield improvement, SMT and back-end packaging integration, DFM constraints, FMEA, SPC, DOE, JMP statistical analysis, project management
Preferred skills
System-in-Package (SiP) design, exposed inductor integration, structural configuration, global stakeholder management, reliability requirements
Technologies
SMT, back-end packaging, JMP, FMEA, SPC, DOE
Responsibilities
Define simplified manufacturing process sequences, manage new product executions from prototyping to RTM, collaborate with factory operations to meet quality and cost standards, engage with global technology teams to establish process capabilities
Seniority
Senior, hands-on IC
