Manufacturing Process Development Engineer
Core
Lead processing of singulation and facet preparation on edge emitting laser components through the back end of line, sustaining existing processes and developing processes for new technologies.
Role type
Manufacturing Process Development Engineer
Builds
Edge emitting laser components
Domain
Semiconductor / Advanced Manufacturing
Required skills
Wafer cleaving, Thinned wafer processing, Singulation, Facet coating preparation, Pick and place processes, Bar stacking/unstacking, SPC controls, FMEA, OCAP, Root cause analysis, DOE, Statistical analysis
Preferred skills
Semiconductor wafer fabrication, Wafer die singulation, Pick and place equipment, Automation, Advanced process control, JMP, Excel, SQL, Python
Responsibilities
Develop and sustain wafer cleaving and facet coating preparation processes; Establish and maintain specifications, SPC controls, FMEAs, and OCAPs; Develop and sustain pick and place and bar stacking/unstacking processes; Provide real-time engineering support for thinning operations; Lead response to process excursions and tool issues; Investigate yield losses and defects; Utilize SPC, DOE, and statistical analysis tools to identify improvement opportunities.