Manufacturing Process Development Engineer
Core
Lead processing of singulation and facet preparation on edge emitting laser components through the back end of line, sustaining existing processes and developing processes for new technologies.
Role type
Manufacturing Process Development Engineer
Builds
Edge emitting laser components
Domain
Semiconductor manufacturing / Advanced manufacturing
Required skills
Wafer cleaving, Thinned wafer processing, Singulation, Facet coating preparation, Pick and place processes, Bar stacking/unstacking, SPC controls, FMEAs, OCAPs, Root cause analysis, DOE, Statistical analysis
Preferred skills
Semiconductor wafer fabrication, Wafer die singulation, Pick and place equipment, Automation, Advanced process control, JMP, Excel, SQL, Python
Responsibilities
Develop and sustain pick and place processes and equipment, Develop and sustain bar stacking/unstacking to and from fixtures for facet processing, Provide real-time engineering support for thinning operations in high-volume manufacturing, Lead response to process excursions, tool issues, and product at-risk situations, Investigate yield losses, defects, and reliability issues and implement corrective and preventative actions, Utilize SPC, DOE, and statistical analysis tools to identify root causes and improvement opportunities
Seniority
Mid-Senior, hands-on IC