Silicon Photonics Packaging Technical Leader

## Responsibilities - Serve as the primary technical interface for the Client Optics Group with top-tier Outsourced Semiconductor Assembly & Test (OSAT) driving advanced package assembly, test, and qualification for silicon photonics products. - Lead the design and layout of test vehicles to validate packaging processes; conduct rigorous design reviews for complex substrates, ensuring alignment with signal/power integrity requirements and manufacturing capabilities. - Cross-functional technical leadership to proactively identify and mitigate risks, resolve highly complex assembly issues, and establish best-in-class quality and reliability standards across the supply chain. - Work collaboratively with other internal teams to influence package architecture and provide expert guidance on DfM, DfR, contributing to the definition of critical process parameters for HVM. Engage deeply in substrate design, materials selection, and reviews. - Present technical findings and recommendations to cross-functional teams and stakeholders. - Stay informed on emerging packaging technologies and industry trends, contributing to the evaluation of new materials, processes, and architectures. ## Requirements - Masters Degree in Mechanical Engineering, Electrical Engineering, Physics, Materials Science, or a related field with 8+ years of experience in Photonics or Semiconductor Packaging Industry or a PhD in Mechanical Engineering, Electrical Engineering, Physics, Materials Science, or a related field with 3+ years of experience in Photonics or Semiconductor Packaging Industry - Proven experience in advanced Silicon Photonic package technology development, such as 2.5D/3D integration, TSV, flip-chip, stacking, hybrid integration, wafer-level packaging, and package technology qualification methods - Prior experience of package design & architecture, including substrate design and chip fabrication. - Experience with advanced substrate manufacturing processes and materials and their impacts to device level signal and power integrity - Experience with industry-standard design and simulation software (e.g., Cadence, klayout, Ansys or similar tools). ## Nice to Have - Prior experience to work within and lead projects with highly cross-functional and geographically distributed technical teams. - Experience with co-packaged optics is a plus - Experience with volume manufacturing - Experience with mechanical and thermal modeling and simulation software - Experience in advanced problem-solving methodologies (e.g., 8D, FMEA, statistical process control) and data analysis skills. ## Benefits - The starting salary range posted for this position is $148,800.00 to $212,900.00 and reflects the projected salary range for new hires in this position in U.S. and/or Canada locations, not including incentive compensation*, equity, or benefits. - U.S. employees are offered benefits, subject to Cisco’s plan eligibility rules, which include medical, dental and vision insurance, a 401(k) plan with a Cisco matching contribution, paid parental leave, short and long-term disability coverage, and basic life insurance. - U.S. employees are eligible for paid time away as described below, subject to Cisco’s policies: - 10 paid holidays per full calendar year, plus 1 floating holiday for non-exempt employees - 1 paid day off for employees ## About the Role This is a hybrid role with two days per week at Cisco’s Carlsbad or Allentown office. ## About the Team The Common Hardware Group (CHG) creates innovative hardware platforms central to the AI era, powering Cisco’s core Switching, Routing, and Wireless products for organizations globally. Our innovations in silicon, optics, and hardware platforms—like Silicon One—are shaping the technology industry. We're a global team of creative experts, bringing our unique backgrounds and bold ideas to push boundaries and help each other grow. Because full product development—from design to qualification to production—is within our team, we’re able to think differently, experiment more, and work quickly. Join us to power the future of the digital world. ## Why Cisco? At Cisco, we’re revolutionizing how data and infrastructure connect and protect organizations in the AI era – and beyond. We’ve been innovating fearlessly for 40 years to create solutions that power how humans and technology work together across the physical and digital worlds. These solutions provide customers with unparalleled security, visibility, and insights across the entire digital footprint. Fueled by the depth and breadth of our technology, we experiment and create meaningful solutions. Add to that our worldwide network of doers and experts, and you’ll see that the opportunities to grow and build are limitless. We work as a team, collaborating with empathy to make really big things happen on a global scale. Because our solutions are everywhere, our impact is everywhere. We are Cisco, and our power starts with you.