IC Package Design Technical Leader
Required skills
Bachelor's degree in electrical engineering or a related field with 12+ years of work experience, Master's degree in Electrical Engineering or a related field with 8+ years of work experience, Experience in high-speed package design, Experience with industry-standard EDA tools for package layout and design, Experience with technical leadership in complex hardware or silicon development programs
Preferred skills
Extensive experience in ASIC package design, Knowledge of silicon floor planning, Experience leading or mentoring engineering teams, Experience coordinating complex cross-functional hardware development programs, Experience with testing and measurement equipment, Experience with scripting languages such as Python, Perl, TCL, or shell programming
Technologies
Cisco Silicon One, Silicon, Optics, EDA tools, Oscilloscopes, TDR/VNA analyzers
Responsibilities
Lead complex package design programs, Optimize package pinouts, stack-ups, power distribution, and high-speed routing, Collaborate with silicon floor planning, signal integrity (SI), and power integrity (PI) teams, Serve as the technical and organizational leader of the San Jose package design team, Develop and grow package design capability within the team, Coordinate resources across designers, layout editors, and contractors, Enhance package design methodologies and partner with vendors, Drive innovation in package solutions
Seniority
Technical Leader, Team Leader
Domain
Hardware, Silicon, Networking, AI Era
