Package Integration Engineer
Core
Develop custom silicon packaging solutions for modules and systems serving consumer markets.
Role type
Senior IC packaging engineer
Builds
Custom silicon packaging modules and systems
Domain
Semiconductor manufacturing and consumer electronics
Required skills
IC packaging design, supplier management, process qualification, reliability testing, yield analysis, packaging roadmap planning, DOE design, material selection, wafer bumping, flip chip die attach, encapsulation/molding, under-fill, ball attach, package singulation, tape & reel, RDL, BEOL assembly, device physics, component/board level reliability testing
Preferred skills
AutoCAD, APD, multi-physics simulation, wafer back-grind, wafer dicing, multilayer thin die stacking
Technologies
AutoCAD, APD, multi-physics simulation
Responsibilities
Define package characteristics based on performance, cost, and footprint requirements; define package/packaging specifications; work with suppliers on design, materials, equipment, and process flow; perform proof of concept builds, POR establishment, qualification, reliability testing, and yield analysis; coordinate with cross-functional teams to meet development schedules; deliver packaging milestones; define packaging roadmap; manage suppliers' R&D activities.
Seniority
Senior, hands-on IC
