Silicon Photonics & Optical Packaging Eng
Core
Lead silicon photonics packaging technology development, defining architecture, assembly processes, and optical coupling designs for high-volume, low-cost optical interconnects.
Role type
Senior IC silicon photonics & optical packaging engineer
Builds
High-efficiency optical I/O modules, SiPh engine/chiplet packages, and co-packaging solutions
Domain
Semiconductor industry + silicon photonics/optical interconnects
Required skills
silicon photonic device design and modeling, optical packaging architecture definition, micro-optical component assembly and interface characterization, simulation of optical systems, cross-functional collaboration for scalable manufacturing, documentation and technical presentation
Preferred skills
CMOS BEOL wafer scale processing, flip chip assembly (CoC, CoW, WLP), active and passive fiber alignment, SiPh device component knowledge (lasers, modulators, PDs, waveguides, MUX/DeMUX), advanced packaging technologies
Technologies
Lumerical, Zemax, COMSOL
Responsibilities
Design and model silicon photonic devices and optical interconnects optimizing coupling, thermal, and signal integrity; Develop and simulate optical packaging architectures integrating photonic chips, fibers, and electronics; Prototype and characterize integrated photonic packages correlating simulation with measurements; Collaborate with cross-functional teams to enable scalable, manufacturable designs; Document results and present technical findings
Seniority
Senior, hands-on IC
