SoC Packaging Engineer
Core
Develop and deploy advanced packaging technologies for silicon photonic devices, interfacing between product design, process integration, and external suppliers.
Role type
Senior IC SoC Packaging Engineer (Silicon Photonics)
Builds
High-volume manufacturing packaging solutions for silicon photonic chips and modules
Domain
Semiconductor manufacturing / Silicon Photonics / Advanced Packaging
Required skills
Advanced 2.5D/3D packaging, Chip-on-Wafer processes, Photonic component assembly (FAU and fiber), MCM module assembly, NPI to mass production yield management, Root cause analysis, Supplier management, R&D execution
Preferred skills
Optics and photonics fundamentals, Optical device integration (lasers, modulators, photo detectors), Independent research and development
Technologies
Silicon Photonics (SiPH), 2.5D/3D packaging, FAU, Fiber assembly, MCM
Responsibilities
Evaluate leading edge Photonic packaging technologies and improve Silicon Photonic performance, yield, and reliability. Define package characteristics and specifications while solving device and yield issues from NPI to mass production. Work with foundries, design houses, and suppliers on Co-package optics development, including new material and equipment selection. Perform proof of concept builds, test vehicle validation, and process qualification. Define packaging roadmap based on long-term product requirements and manage R&D activities.
Seniority
Senior, hands-on IC
