Packaging Engineer
Core
Adapting industry standard packaging processes and materials to the unique requirements of quantum devices, including end-to-end assembly and build execution.
Role type
Packaging Engineer (Quantum Devices)
Builds
Quantum device packages and assemblies
Domain
Quantum computing / Optomechanical / MEMS / Microwave
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Quantum device packaging, wire bonding, die bonding, adhesive dispense, PCB handling, soldering, process optimization, reliability testing, adhesive characterization, assembly process failure analysis, manufacturing equipment operation, AI tool utilization for performance modeling and task automation
Preferred skills
None stated
Technologies
None stated
Responsibilities
Adapt packaging processes and materials for quantum devices, execute end-to-end assembly, operate and optimize manufacturing equipment, maintain configuration documentation, analyze and solve assembly process failures, conduct reliability testing and adhesive characterization, develop robust assembly processes, support laboratory organization
Seniority
Mid-level, hands-on IC
