Wissenschaftliche*r Mitarbeiter*in: Interconnect Technologies (all genders)
Core
Research and development of interconnect technologies for 300mm wafer CMOS manufacturing, focusing on BEOL metallization, chemical mechanical polishing (CMP), and advanced packaging integration.
Role type
Senior Research Scientist (Semiconductor Manufacturing)
Builds
BEOL metallization modules and advanced packaging solutions for chip manufacturers and partners
Domain
Semiconductor manufacturing / Microelectronics / Materials Science
Required skills
BEOL process integration, Chemical Mechanical Polishing (CMP), Advanced Packaging, Semiconductor fabrication technologies, Project management, Public grant acquisition, Cross-industry collaboration
Preferred skills
HVM platform experience (PVD), Wet chemical cleaning, Silicon interposer technologies, Conference presentation
Technologies
CMP, PVD, 300mm wafers, ECD, BEOL, Advanced Packaging, Silicon Interposer
Responsibilities
Conduct R&D in interconnect technologies, Integrate UPD solutions for BEOL metallization modules, Manage complex cross-group development projects, Evaluate and develop new metallization solutions, Assess project feasibility in 300mm cleanroom, Develop synergies between BEOL and advanced packaging, Lead project acquisition for industrial and public funding, Present research at conferences
Seniority
Senior, hands-on IC