Principal Signal Power Integrity Engineer, Texas Institute for Electronics
Core
Lead end-to-end Signal Integrity (SI) and Power Integrity (PI) simulations for advanced 2.5D/3.0D heterogeneous integration packages and multi-chiplet stacks.
Role type
Principal Signal Power Integrity Engineer
Builds
Accurate, reusable electrical models (S-parameters, RLCK) and reference flows for the 3D Assembly Design Kit (ADK) to enable system-level co-design.
Domain
Semiconductor manufacturing, advanced packaging, 3D heterogeneous integration, high-speed interfaces
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
SI/PI analysis, EM extraction, PDN design, high-speed signaling fundamentals, scripting/automation (Python/Tcl/SKILL), tool interoperability
Preferred skills
Multi-material package expertise, channel compliance/link-budget analysis, industry standards familiarity, thermal/mechanical co-simulation
Technologies
Ansys HFSS/SIwave, Cadence Sigrity/Clarity 3D, Synopsys RaptorX, Keysight ADS/PathWave, Siemens HyperLynx
Responsibilities
Own SI/PI analysis from interconnect architecture to final signoff; Perform high-speed interconnect modeling and extraction; Architect and optimize power delivery networks (PDN); Execute full SI simulation workflows; Build and validate SI/PI models for the ADK; Develop reference flows and automation; Collaborate with EDA vendors and OSATs; Guide technical strategy and mentor engineers
Seniority
Principal, hands-on IC with strategy & mentorship
