Director of Technology, Texas Institute for Electronics
Core
Lead pathfinding programs in advanced heterogeneous integration and semiconductor manufacturing processes to address national security needs and catalyze domestic economic growth.
Role type
Director of Technology (Semiconductor Manufacturing & Advanced Packaging)
Builds
Pilot manufacturing capabilities and state-of-the-art semiconductor process flows for heterogeneous integration, advanced packaging, and chip cooling.
Domain
Semiconductor manufacturing, advanced packaging, heterogeneous integration, defense electronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Strategic program management, semiconductor fabrication expertise, team leadership, process integration R&D, technology roadmap development
Preferred skills
Advanced semiconductor process knowledge (patterning, etching, deposition, metrology), graduate degree in relevant engineering discipline
Technologies
Semiconductor fabrication equipment, process integration tools, metrology systems
Responsibilities
Provide vision and direction for pathfinding programs in advanced heterogeneous integration; Identify key priorities in advanced semiconductor technology; Manage a multi-disciplinary team to achieve research and strategic goals; Oversee development of semiconductor process flows.
Seniority
Director/Executive Director, strategic leadership with hands-on technical oversight
