Principal Chip Lead
Core
Lead the design, verification, testing, and validation of power management subsystems for mixed-signal SoC products from tapeout through production.
Role type
Principal IC design lead (mixed-signal SoC)
Builds
Power management ICs (VRMs, multiphase controllers, Smart Power Stages, Power Towers, MOSFETs) for advanced computing platforms
Domain
Semiconductor hardware design (analog/mixed-signal) and power electronics
Required skills
Mixed-signal SoC design, analog and mixed-signal design, RTL and digital design, design verification, system-level architecture, automated bench testing, silicon validation, root cause analysis, technical mentorship
Preferred skills
Firmware development, behavioral modeling, product lifecycle management
Technologies
Embedded Firmware, IoT, AI, Hardware, SPS
Responsibilities
Own the design, verification, testing, and validation of assigned power management subsystems through production and ongoing product support. Collaborate across firmware, test, product, and customer engineering teams to define requirements, resolve problems, and guide technical decisions. Analyze customer returns and field issues to identify root causes and support long-term product quality. Contribute to system-level architecture and design reviews. Mentor junior engineers and help foster technical development across the team. Improve design methodologies, verification strategies, and validation approaches.
