Wafer Fab Technician – PECVD, Dry Etch & Wet Etch
Core
Operate PECVD, dry etch, and wet etch systems to run volume production of InP photonic devices (BH DFB lasers and BH Gain Chips) while ensuring process stability and yield.
Role type
Senior IC wafer fab process technician (III-V/InP)
Builds
InP Buried Heterostructure DFB lasers and BH Gain Chips
Domain
Semiconductor manufacturing / Photonics / III-V materials
Required skills
PECVD dielectric deposition, ICP/RIE dry etch, wet etch, root-cause analysis, SPC control, recipe management, tool qualification, defect inspection, cleanroom operations, chemical safety
Preferred skills
III-V/InP process experience, mentorship, DOE support, NPI qualification
Technologies
PECVD, ICP/RIE, ellipsometer, reflectometer, profilometer, SEM
Responsibilities
Operate PECVD, dry etch, and wet etch tools for volume production; lead root-cause investigations for process excursions; own SPC control charts and process recipes; perform tool qualification and preventive maintenance; mentor junior operators.
Seniority
Senior, hands-on IC