Principal Field Application Engineer – SIP for Data Center
Core
Secure design wins and lead co-development for high-speed analog ICs (optical/copper) in AI data center networks, serving as a trusted technical advisor to Tier 1 hyperscalers.
Role type
Principal Field Application Engineer (Strategic IC Sales & Co-Development)
Builds
High-speed optical and copper interconnect solutions for AI data centers, PON, and mobile transport
Domain
Semiconductor / Optical Communications / Data Center Infrastructure
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Signal integrity (high-speed principles, modulation, equalization), Optical transceiver architecture, High-speed PCB design, Test equipment proficiency (network analyzers, BER testers), IEEE/OIF standards knowledge, Customer co-development leadership, Strategic technical advisory
Preferred skills
Laser/modulator driver expertise, Industry standards body participation, Hyperscaler customer relationships
Technologies
800G/1.6T/3.2T interconnect, LPO/LRO/NPO/CPO architectures, High-speed analog/mixed-signal ICs, DSPs
Responsibilities
Drive design wins for high-speed drivers and TIAs, Lead next-gen technology co-development with customer engineering teams, Provide pre/post-sales support for PON and Mobile Transport accounts, Troubleshoot complex technical issues and guide hardware design, Influence product roadmaps based on customer insights, Create application notes and design guides
Seniority
Principal, strategic advisor & hands-on IC expert