Wafer Fab Process Engineer
Core
Engineering wafer fab processes (plasma etch, thin film deposition, lithography, wet cleans) for next-generation uncooled infrared detector designs.
Role type
IC process engineer (semiconductor/MEMS)
Builds
Next-generation infrared detector focal plane arrays
Domain
Semiconductor/MEMS fabrication, infrared detector technology
Deliverable
production ML models | product features
Required skills
Wafer fabrication process design, hands-on pilot lot processing, quantitative metrology (SEM/FIB/SEM), statistical process control (SPC), data analysis (Excel, MATLAB, JMP, Python, SQL), process automation
Preferred skills
Infrared detector technology, Design of Experiments, Lean Six Sigma, 8D/Kepner-Tregoe problem solving
Technologies
Plasma etch, thin film deposition, lithography, wet bench chemistry, MES, SEM, FIB/SEM, interferometers
Responsibilities
Innovate new processes to enable technology roadmap, design and execute experiments and analyze data, own tools and process modules, establish feasibility via hands-on processing, characterize results using metrology tools, automate or improve established processes, evaluate production yield challenges
Seniority
Mid-level, hands-on IC
