Principal FEOL Technology Development Engineer
Core
Develop, optimize, and document front-end process flows and macro modules for fabricating Power Trench MOSFETs and BCD devices.
Role type
Principal FEOL Technology Development Engineer
Builds
Power Trench MOSFETs and BCD (BiPolar-CMOS-DMOS) devices
Domain
Semiconductor manufacturing (Power devices, CMOS, BCDMOS, Wide Bandgap)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Front-end process modules (Silicon, Epi, Diffusion, Etch, Photo, Thin Films), Process Integration (CMOS/BCDMOS, Discrete IGBTs/MOSFETs), Silicon semiconductor device physics, Process Flow Design for manufacturability, Electrical test data correlation, Failure analysis interpretation, Power packaging assembly and reliability, Backend processes (BGBM, STM), FMEA development, DoE design and data analysis (JMP, Spotfire), TCAD process simulations, Design layout interpretation
Preferred skills
Technical leadership, cross-functional collaboration
Technologies
JMP, Spotfire, TCAD tools
Responsibilities
Set up and perform process and device simulations to determine initial process parameters; Design and perform experiments to determine process sequences and parameters; Analyze electrical, in-process, and visual inspection data to identify optimization needs; Work with Process Engineering to develop and optimize process modules; Support initial test chip and transfer lot processing to identify and correct problem areas; Provide inputs to Device Engineers for layout rules using equipment specifications and experimental data; Recommend test structures and contribute to test chip mask set layouts; Provide development updates to upper management and external customers; Support company initiatives including quality, safety, environmental management, CQI, 5S, yield management, and cost containment
Seniority
Principal, hands-on IC with technical leadership
