Semiconductor Packaging Engineer
Core
Lead development of advanced semiconductor packaging solutions for MEMS sensors serving automotive, industrial, medical, aerospace, and defense markets.
Role type
Senior Systems Semiconductor Packaging Engineer
Builds
Robust, scalable packaging solutions for MEMS sensors
Domain
Semiconductor manufacturing / MEMS / Sensors
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor packaging expertise, Materials knowledge (substrates, adhesives, underfills, mold compounds), Design for reliability, Simulation and analysis tools (SolidWorks, ANSYS), Structured problem solving (DOE, PFMEA, SPC, 8D, RCA), Cross-functional collaboration
Preferred skills
MEMS/sensor/advanced package development experience, OSAT/vendor collaboration experience
Technologies
SolidWorks, ANSYS
Responsibilities
Lead project-level semiconductor packaging design from concept to manufacturing readiness, Drive design for manufacturability and reliability through process characterization and risk assessment, Perform root cause analysis and yield improvement initiatives, Evaluate mechanical and process performance using 3D CAD and simulation tools, Apply engineering methodologies (control plans, PFMEA, DOE, SPC, 8D, RCA) to improve outcomes, Translate customer specifications into technical direction for internal teams, Collaborate with OSAT partners for prototyping and qualification, Align package designs with vendor assembly capabilities and constraints
Seniority
Senior, hands-on IC
