Engineer I, Process Development
Core
Develop, optimize, and sustain SMT reflow soldering and post-reflow cleaning processes to ensure high product quality, reliability, and manufacturing efficiency in semiconductor and electronics assembly.
Role type
Process Development Engineer (SMT/Assembly)
Builds
SMT reflow soldering and flux cleaning processes for semiconductor and electronics assembly
Domain
Semiconductor manufacturing / Electronics assembly
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
DOE (Design of Experiments), root cause analysis, process parameter monitoring, defect troubleshooting, SOP/FMEA/SPC development, data analysis, technical reporting
Preferred skills
NPI support, equipment qualification, continuous improvement, yield improvement
Technologies
SMT equipment, reflow ovens, flux cleaning systems, SPC tools
Responsibilities
Develop and optimize reflow soldering and flux cleaning processes; Monitor and improve key process parameters (temperature profiles, conveyor speed, atmosphere, chemistry); Troubleshoot defects (solder bridging, voiding, non-wet opens, flux residue, delamination); Perform DOE and root cause analysis; Support NPI, process qualification, and equipment buyoff; Establish process control plans, SOPs, FMEA, and SPC monitoring; Collaborate with production, quality, and equipment teams; Drive continuous improvement for cycle time and cost; Analyze process data and prepare technical reports; Ensure EHS and manufacturing compliance; Support customer and internal audits.
