Packaging SBU Product Line Management IV - (E4)
Core
Manage service product development lifecycle for wafer-level packaging semiconductor equipment, ensuring service readiness and solving high-value customer problems.
Role type
Senior Product Line Manager (Service)
Builds
Service product offerings, documentation, spare part strategies, and training materials for semiconductor manufacturing equipment.
Domain
Semiconductor manufacturing / Wafer-level packaging / Equipment services
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Program management, Wafer-level packaging equipment knowledge, Technical program management, Market opportunity assessment, Cross-functional team leadership, ROI analysis, Service readiness planning, New product introduction (NPI) integration, Validation data collection, Executive presentation
Preferred skills
Chemical/Mechanical/Electrical/Material/Data Science background, Semiconductor industry experience, AIx growth engine development, Design for Install/Service expertise
Technologies
Microsoft Office suite (PowerPoint, Excel)
Responsibilities
Lead HVP discovery through VOC & FSO, Propose and select solutions based on ROI estimates, Chair Core Team meetings to drive design & development, Accountable for successful beta demonstration, Drive creation of Marketing Collateral and Field Training, Collaborate on NPIs and Legacy tools to embed service offerings, Spearhead AIx growth engine, Coordinate Service Product Roadmap releases, Prepare and Deliver Monthly Product Reviews
Seniority
Senior, hands-on IC with strategic growth partnership
