External Manufacturing NPI Engineer
Core
Lead backend external manufacturing NPI from conceptualization through production launch for new semiconductor products.
Role type
Senior IC manufacturing NPI lead
Builds
New semiconductor package platforms and complex derivative products
Domain
Semiconductor manufacturing (backend, assembly, OSAT)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
semiconductor assembly process expertise, DFM, technology readiness, risk analysis, production ramp management, cross-functional team leadership, statistical analysis, DOE characterization, SPC, failure analysis, project management
Preferred skills
SiC, GaN, CIS Imaging wafer technology experience, Chip-to-Package Interaction (CPI) knowledge, IC package design/CAD/simulation, OSAT business landscape knowledge, Mandarin language proficiency
Technologies
CAD, simulation tools, data analytics platforms
Responsibilities
Interface and steer cross-functional engagements across Business Units, Engineering, Operations, Quality, Supply Chain, and Procurement; Partner with OSATs to deliver assembly readiness including process flow setup, risk mitigation, and qualification; Manage production ramp including safe launch, technical support, and transition to high-volume manufacturing; Establish Best Known Methods and drive continuous yield improvement; Act as Subject Matter Expert for package and assembly challenges.
Seniority
Senior, hands-on IC with team management capability
