Metal-Package Process Support Engineer
Core
Provide on-site technical support and optimize Metal-Package semiconductor processes for advanced packaging technologies.
Role type
Senior IC process support engineer (semiconductor packaging)
Builds
Next-generation semiconductor packaging solutions for display and chip manufacturers
Domain
Semiconductor manufacturing / Advanced packaging / Materials science
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
PVD process support, DOE design and execution, statistical data analysis, root cause analysis, system diagnostics, process troubleshooting, technical reporting
Preferred skills
PVD hands-on experience, Charger system experience, Metal-Package process expertise, customer-facing support experience
Technologies
Chemical Vapor Deposition, Atomic Layer Deposition, Plasma Reactive Ion Etch, Physical Vapor Deposition, Anneal, Implant
Responsibilities
Provide on-site system installation, diagnostics, service, and repair; Develop and optimize Metal-Package processes; Execute process experiments and analyze data; Diagnose and resolve complex process and system issues; Collaborate with customers and internal stakeholders; Act as a technical resource for junior engineers
Seniority
Mid-Senior, hands-on IC
