Advanced Packaging Process Support Engineer
Core
On-site technical support and process optimization for die-to-wafer bonding systems in advanced semiconductor packaging.
Role type
Process Support Engineer (PSE)
Builds
Die-to-wafer bonding processes for high-volume manufacturing
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Materials Science, Chemistry, Electrical/Electronics Engineering, Semiconductor Engineering, process engineering, equipment support, advanced packaging, root cause analysis, DOE design, statistical data analysis, hybrid bonding, die-to-wafer bonding, wafer-to-wafer fusion bonding, plasma processes, DRY cleaning, WET cleaning, TC bonding, flip chip bonding, backend packaging
Preferred skills
Applied Materials KINEX systems experience
Technologies
KINEX bonding systems, Chemical Vapor Deposition, Atomic Layer Deposition, Plasma Reactive Ion Etch, Physical Vapor Deposition, Anneal, Implant
Responsibilities
Provide on-site technical support for Applied KINEX bonding systems including installation, qualification, troubleshooting, and process stabilization; Support and optimize die-to-wafer bonding processes for advanced packaging applications; Act as a process owner for Hybrid Bonding technologies; Design and execute process experiments and DOE, analyze data, and deliver clear technical conclusions; Resolve complex equipment and process issues using structured root cause analysis; Collaborate with customers, field service, and internal teams to ensure stable production and yield improvement; Support small-scale technical projects and continuous process improvements
Seniority
Mid-Senior, hands-on IC
