Structural, Thermal & Packaging Analyst (Semiconductor FEA) IV
Core
Technically lead and execute engineering projects, spearhead R&D of new technologies, and troubleshoot complex physics-related system issues for semiconductor and display manufacturing equipment.
Role type
Senior IC structural, thermal & packaging analyst (FEA)
Builds
Complex modules, sub-modules, and complete systems for semiconductor and display chip manufacturing equipment
Domain
Semiconductor manufacturing equipment / Materials engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Finite Element Analysis (FEA), complex system design, physics/science troubleshooting, risk management, vendor management, feasibility study execution, technology evaluation, mentoring
Preferred skills
Strategic vendor selection, university/consortia engagement, competitive technology analysis, new technology demonstration
Technologies
FEA tools, semiconductor manufacturing equipment systems
Responsibilities
Define experiments and determine data requirements for technical decisions; lead module design and engineering; troubleshoot complex physics-related application and system issues; review and approve system requirements; initiate innovative physics/science projects; plan and execute complex feasibility studies; provide mentoring for less experienced staff
Seniority
Senior, hands-on IC
