Senior Director, Silicon Hardware Engineering - Boards, Packaging, & Reliability
Core
Lead global silicon hardware engineering for chip package development, board hardware, and power/reliability to deliver high-performance FPGA solutions.
Role type
Senior Director, Silicon Hardware Engineering (IC/Board/Reliability)
Builds
Advanced semiconductor packages, board-level hardware, and reliable silicon power solutions for FPGA products
Domain
Semiconductor / FPGA / Hardware Engineering
Deliverable
production ML models | product features | infrastructure
Required skills
Advanced packaging (2.5D/3D IC, flip-chip), board hardware design, signal integrity (SI), power integrity (PI), OSAT management, silicon design methodologies, vendor management, program execution
Preferred skills
Master's degree in EE/CE, 15+ years semiconductor experience, 5+ years senior leadership
Technologies
Ansys SIwave, Cadence Sigrity, HyperLynx
Responsibilities
Define technical strategy for package/board/power functions; lead distributed global teams; manage multi-vendor supply chain; drive cost reduction and program delivery; align cross-functional hardware development
Seniority
Senior, hands-on IC leadership