Substrate Engineer
Core
Manage and resolve issues relating to packaging, manufacturing, yield, quality, and delivery of high volume semiconductor devices with substrate subcontractors.
Role type
Senior IC packaging substrate engineer
Builds
High volume IC substrate manufacturing and packaging solutions
Domain
Semiconductor manufacturing / Packaging
Required skills
NPI activities, risk assessment, process improvement, production engineering support, cross-functional collaboration, new product pre-production engineering, yield improvement, cycle time optimization, site standardization, supplier qualification, HVM transition, cost reduction
Preferred skills
Best Known Methods (BKM) implementation, compliance verification, capability enhancement
Technologies
Semiconductor packaging tools, manufacturing execution systems
Responsibilities
Manage and resolve issues with substrate subcontractors regarding packaging, manufacturing, yield, quality, and delivery; Lead NPI activities and risk assessment for high volume IC substrate manufacturing; Collaborate with cross-functional engineering teams on interactive issues and newly developed packaging technology; Drive new product pre-production engineering and improve process/mechanical yields and cycle time; Implement site standardization using Best Known Methods and verify compliance with Broadcom requirements; Lead capability enhancement and cost reduction projects; Qualify new substrate suppliers and support transition to high volume manufacturing (HVM)
