Hardware Engineer
Core
Lead end-to-end development of cutting-edge Co-Packaged Optics (CPO) products, driving architecture, design, validation, and production of integrated photonic/electronic systems.
Role type
Technical Lead, Advanced Co-Packaged Optics (CPO)
Builds
Integrated photonic/electronic systems for CPO products
Domain
Integrated Photonics & Electronics
Deliverable
production ML models | product features
Required skills
CPO product architecture, subsystem interface definition, photonic/electronic IC design, optical engine packaging, substrate/PCB development, schematic capture, circuit simulation, SI/PI analysis, mechanical integration, fiber alignment, prototype bring-up, system-level troubleshooting, validation testing, project planning, mass production transfer, ATE software requirements, manufacturing test algorithms
Responsibilities
Define CPO product architecture and subsystem interfaces; Champion design decisions balancing performance, manufacturability, and cost; Provide expert guidance on photonic/electronic IC design and packaging; Coordinate cross-functional R&D teams; Lead detailed hardware design and mechanical integration; Oversee prototype bring-up and validation testing; Develop project plans from concept to mass production; Define ATE software requirements and manufacturing test algorithms; Provide technical support to customers and resolve field issues
Seniority
Senior, hands-on IC & team leadership
