IC Package Thermal Mechanical Engineer
Core
Mechanical design and thermo-mechanical simulation of complex semiconductor packages for high-performance computing, AI, and networking products.
Role type
IC Package Thermal Mechanical Engineer
Builds
Advanced semiconductor packages for HPC, AI, and networking products
Domain
Semiconductor manufacturing / Electronic packaging
Deliverable
production ML models | product features
Required skills
Finite Element Analysis (FEA), multiphysics simulation, structural mechanics, heat transfer, fluid dynamics, reliability testing, Python, MATLAB, Ansys APDL
Preferred skills
Electromigration reliability assessment, material characterization (DMA/TMA, nano-indentation), thermal analysis (Icepak, Flotherm), Machine Learning integration
Technologies
ANSYS (Classic/Mechanical), Python, MATLAB, Ansys APDL, Icepak, Flotherm
Responsibilities
Develop and validate numerical FEA and multiphysics models to evaluate package stress, strain, deformation, warpage, thermal cycling, and delamination; Conduct and oversee hands-on reliability lab testing to investigate package failure mechanisms; Streamline simulation workflows by developing reusable model-generation and reliability-data-analysis tools; Apply structural mechanics, fluids, and heat transfer knowledge to solve chip-package and package-board interaction challenges.
Seniority
Senior, hands-on IC
