Sr. Staff Thermal Engineer
Core
Leading thermal analysis and validation for advanced semiconductor packaging and system designs to enable high-performance AI and HPC workloads in data centers.
Role type
Sr. Staff Thermal Engineer (packaging & systems)
Builds
Next-generation photonics engines and AI data center compute systems
Domain
Semiconductor packaging, thermal management, AI data centers, high-performance computing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
thermal analysis, semiconductor packaging technologies, heat transfer concepts, CFD simulation, lab-scale validation, Python/MATLAB scripting, ANSYS tools (Icepak/Fluent/Flotherm)
Preferred skills
fluid dynamics, assembly process modeling, two-phase immersion cooling, thermal control algorithms, statistical analysis (DOE/JMP)
Technologies
ANSYS Icepak, ANSYS Fluent, Flotherm, Python, MATLAB, TECs, heat pipes, vapor chambers, thermal interface materials, phase change materials, liquid cooling systems
Responsibilities
Perform thermal simulations to influence package and system design; Propose novel thermal solutions for the product portfolio; Develop and validate thermal models for packaging designs; Collaborate with design engineers to optimize thermal management solutions; Drive characterization and validation of thermal designs through prototyping and experiments; Develop automation scripts to improve modeling efficiency; Write reports and document methodologies
Seniority
Sr. Staff, hands-on IC with strategic influence
