HSIP Application Engineer
Core
Support Tier 1 customers in designing products using Broadcom's high-speed interconnect (100/400/800/1600 Gigabit) physical layer solutions, securing design wins and ensuring successful product launches.
Role type
Senior IC Applications Engineer (High Speed Interconnect)
Builds
High-speed SerDes and optical system solutions for enterprise and data center networking
Domain
Semiconductor / High-Speed Interconnect / Optical Networking
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
High-speed SerDes architecture, Ethernet system standards, 100Gbps/200Gbps optical systems, C/C++ programming, PCB layout and schematic review, board bring-up and debugging, customer architecture analysis
Preferred skills
OTN experience, PAM4 modulation, optical component testing, Signal Integrity analysis, register-level programming of SoC devices
Technologies
C, C++, Visual Basic, Ethernet traffic generators, High-speed oscilloscopes, Jitter Analyzers, Spectrum Analyzers, Network Analyzers, OTN testers
Responsibilities
Support architecture and low-level hardware questions, pre-sales and post-sales support via email/phone/visits, documentation, product definition and roadmap, analysis of customer requirements, debugging complicated issues, board debugging and bring up, training customers and Field Applications Engineers
Seniority
Senior, hands-on IC