Senior Product Manager
Core
Define and manage the full lifecycle of multi-die package and system-in-package products integrating MCUs, gate drivers, power devices, and memory devices for the semiconductor industry.
Role type
Senior Product Manager (Semiconductor Packaging)
Builds
Multi-die packages and System-in-Package (SiP) solutions
Domain
Semiconductor / Electronics / Packaging
Deliverable
product features
Required skills
Multi-die packaging architecture, System-in-Package (SiP) integration, MCU and power device knowledge, thermal management, supply chain coordination, product roadmap planning, business case development
Preferred skills
Master's degree or MBA, experience with OSAT partners
Technologies
MRDs, PRDs, semiconductor packaging tools
Responsibilities
Analyze market dynamics and technology trends for integrated semiconductor products, define product roadmaps and portfolio plans, lead system-level product definition across multiple device functions, coordinate internal and external resources across wafer suppliers and OSAT partners, track product performance and recommend roadmap adjustments
