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Tape Out Engineer

Hsinchu💼 Full-time🗓 2026-05-06 → 2026-07-31

Core

Final checkpoint role ensuring semiconductor design data meets manufacturing requirements before fabrication.

Role type

Tape Out Engineer

Builds

Integrated circuit designs for semiconductor products

Domain

Semiconductor manufacturing / Physical design

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work -> infrastructure (design data for fabrication)

Required skills

Physical design tools (Cadence, Synopsys), semiconductor manufacturing workflows, database review, discrepancy resolution, cross-functional collaboration

Preferred skills

Master's degree in Electrical/Computer Engineering

Technologies

Cadence, Synopsys

Responsibilities

Coordinate and execute tape out process, verify design integrity by reviewing database and documentation, resolve technical issues with cross-functional teams, ensure deliverables conform to foundry requirements, maintain detailed records of tape out procedures

Seniority

Individual Contributor (IC)

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