Assembly Technical Program Manager
Core
Drive cost competitiveness, process efficiency, and BOM optimization across semiconductor assembly operations to enable breakthrough cost reductions and next-generation package architectures.
Role type
Senior IC Technical Program Manager (Semiconductor Assembly & Packaging)
Builds
Cost-effective BOMs, high-density packaging solutions, and optimized assembly processes for NXP's global operations.
Domain
Semiconductor manufacturing, specifically assembly and packaging engineering.
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Cost reduction and value engineering, QFN back-end and leadframe package technologies, cross-site/global program management, supplier collaboration and negotiation, BOM and process cost modeling, molding process optimization, PCN and JEDEC standards knowledge, strategic cost engineering, change management in matrix organizations.
Preferred skills
Master's degree in relevant engineering field, experience with super wide leadframe and high-density packaging, executive-level stakeholder management.
Technologies
QFN, leadframe, molding processes, JEDEC standards.
Responsibilities
Lead package cost transformation programs including low-cost BOM optimization and assembly automation; drive operation process innovation for high-density packaging; manage cross-functional engagement with Business Lines on BOM changes; establish governance for cost and technology change programs; coach engineers for technical competency improvements.
Seniority
Senior, hands-on IC with strategic oversight
