2027 Campus_Package Architect
Core
Develop and evaluate packaging solutions for next generation data center and AI silicon products, focusing on signal and power integrity analysis for high-speed interfaces and power delivery networks.
Role type
IC packaging architect
Builds
Packaging solutions for data center and AI silicon products
Domain
Semiconductor / Data Center / AI
Required skills
Packaging solution development, Signal integrity analysis, Power integrity analysis, Power delivery network design, Cross-functional collaboration, Industry trend analysis
Responsibilities
Develop and evaluate packaging solutions for next generation data center and AI silicon products, Perform signal and power integrity analysis for high speed interfaces, Design and analyze power delivery networks for next generation XPUs, Collaborate with cross functional teams to improve packaging solutions for performance and form factor, Understand industry and technology trends
Seniority
Entry-level / Recent Graduate
