Senior High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer
Core
Electrical characterization and failure analysis of High Bandwidth Memory (HBM) products to distinguish package vs. device failures and determine root causes.
Role type
Senior IC electrical failure analysis engineer (semiconductor memory)
Builds
High-performance DRAM, NAND, and NOR memory and storage products
Domain
Semiconductor manufacturing and memory technology
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
DRAM operation knowledge, semiconductor device physics, failure analysis, troubleshooting/debugging, advanced packaging, wafer testing, component testing, module testing, Unix, DFII/Cadence, uMate, Curve Tracer, Oscilloscope
Preferred skills
Master's degree in Electrical/Electronics/Computer Engineering, knowledge of DRAM fabrication process/test program/functionality
Technologies
uMate, Merlin, Mongoose SM3, Prober, CAD layout tools, Unix, DFII, Cadence
Responsibilities
Analyze failed components from reliability testing, interpret historical test results, adjust timing/level/testmode/code/temp to find failure sensitivities, perform visual inspection to identify physical defects, document failed conditions and test results, categorize electrical failures, coordinate next level analysis with various engineering groups, troubleshoot hardware and software issues, repair or coordinate repair of equipment, configure and upgrade test equipment, develop and deploy failure analysis software, assist lab users with equipment setup and operation, conduct on-the-job training for new hires, create and maintain failure analysis databases, track FA data and identify false failures, review test time reduction and design/marketing datasheet requests
Seniority
Senior, hands-on IC
