ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI)
Core
Engineer supporting the transition of next-generation memory and HBM packaging technologies from development to high-volume manufacturing.
Role type
Individual contributor NPI engineer (Advanced Packaging)
Builds
Next-generation memory and HBM packaging technologies
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Design of Experiments (DOE), Failure Mode & Effect Analysis (FMEA), risk assessment, statistical methods, low-volume manufacturing (LVM), run-at-risk (RAR) support, technology transfer
Preferred skills
MES systems, automation, data analytics tools (JMP, Python), semiconductor industry experience, leadership
Technologies
JMP, Python, MES systems
Responsibilities
Integrate AI-assisted tools to improve efficiency and quality; apply engineering and statistical methods to accelerate learning cycles from DOE through product qualifications; partner with development and manufacturing teams for LVM and RAR; perform risk assessments and FMEA; implement control plans and corrective actions; enable smooth technology transfer from development to high-volume manufacturing
Seniority
Individual contributor, operations support
